The navigation controller is the most important core component of the mobile robot (AGV/AMR) and the brain of the entire vehicle body, which is related to the reliability, stability, performance index and safety of the vehicle body. Among the various performances of the navigation controller, in addition to the basic indicators such as the protection level at the hardware level, the embedded level, and the algorithm level, it is also worth paying attention to the indicator of wide temperature. So whether the indicator of wide temperature is the current mobile robot (AGV) /AMR) is an important indicator, reaching -40~80℃ is the application environment of the mobile robot (AGV/AMR).
Mobile robots (AGV/AMR) are widely used today, not only in quick-freezing cold storage and deep cold storage scenarios at -40°C and above, but also in plastic production, rubber, and steel metallurgy at 55~65°C and above. Or lower application environment, the long-term normal and stable operation of the controller is very important.
China's geographical environment
China is a vast country. The highest temperature in the southernmost part of China can reach 47.6 ℃, and the lowest temperature in the northernmost part is as low as -31.3 ℃. There are not only humid environments with little temperature difference between day and night, such as offshore oil and gas production platforms, but also environments with huge temperature differences between day and night, such as space launch centers in deserts and Gobi.
10°C rule
When the ambient temperature increases (changes) by 10°C, the life of the components is significantly reduced.
In terms of machinery, because the product is composed of different materials, the difference in the material expansion coefficient produces mechanical stress. When it is subjected to thermal stress with bidirectional changes in high and low temperature, the change in stress difference has an effective effect on the joint, exposing defects;
In terms of physical chemistry, materials such as rubber and organic plastics in the product become hard and brittle at low temperature, soften and relax at high temperature, and when the temperature exceeds the range of use, their mechanical properties and anti-vibration damping properties will change, resulting in product failure;
In terms of electrical performance, high temperature can cause temperature drift in the circuit, increase the heat generation of the circuit, accelerate the aging and even thermal breakdown of the insulator, affect the magnification and penetration of semiconductor devices such as triodes, and cause product failure.
Due to the increasing density of electronic components used in modern electronic devices, this will cause thermal coupling between components through conduction, radiation and convection. Thermal stress has become one of the most important factors affecting the failure rate of electronic components. In order to achieve the desired reliability goals, the temperature adaptability of components must be achieved to a higher level.
fanless design,
MRC5000 suitable for -40~80℃ wide temperature
The MRC5000 also encountered great difficulties at the beginning of its design. On the one hand, it must meet the protection index of IP65, and no gaps can be left for heat dissipation. At the same time, it must meet a series of computing requirements such as running slam algorithm, motion control algorithm, motion decomposition algorithm, and built-in map task path, which generates a lot of heat. Temperature has a great influence on the failure rate of components. For microcircuits, an increase in temperature of 10°C–20°C approximately doubles the temperature stress coefficient. In order to ensure that the device has a sufficient service life in a wide temperature environment, derating design and thermal design are required; in addition, in order to reduce the influence of temperature-induced component parameter drift, tolerance analysis is also required.
